DYNATRON Air Cooler - B23





 

 

 

 

 

 

 

 

 

Recommend for Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Active Cooler for Blade Server, Support CPU power up to 205 Watts heat dissipation.

 

Additional Information

CPU Support

·         Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor

·         (formerly Cascade Lake, Skylake)

CPU Socket
  • FCLGA 3647 Narrow ILM

Solution

·         1U Server

Dimensions

·         108 x 81.5 x 25.5 mm

Weight

·         460 g

Material
  • Copper1100 Heatsink with Vapor Chamber Base

Fan Dimension

·         Ø80 x 13 mm

Speed

·         At Duty Cycle 0~20%: 2000 ± 200 RPM

At Duty Cycle 50%: 4900 ±10% RPM

At Duty Cycle 100%: 8600 ± 10% RPM

Bearing

·         Double Ball

Rated Voltage

·         12V

Power

·         At Duty Cycle 0~20%: 1.08 W

At Duty Cycle 50%: 4.7 W

At Duty Cycle 100%: 23.45 W

Air Flow

·         At Duty Cycle 0~20%: 5.59 CFM

At Duty Cycle 50%: 14.76 CFM

At Duty Cycle 100%: 26.25 CFM

Noise Level

·         At Duty Cycle 0~20%: 23.3 dBA

At Duty Cycle 50%: 43.5 dBA

At Duty Cycle 100%: 62.2 dBA

Air Pressures

·         At Duty Cycle 0~20%: 3.69 mm-H2O

At Duty Cycle 50%: 25.28 mm-H2O

At Duty Cycle 100%: 89.90 mm-H2O

Lead Wire Pin Out

·         Pin1- (-)

·         Pin2- (+)

·         Pin3- (Techometer/Signal output)

·         Pin4- (PWM)

*All product specifications and product images are subject to change without notice.

 

Downloads

CPU Cooler Specifications

 

 

DYNATRON CORPORATION
U.S.A. HEADQUARTERS
33200 Western Ave. Union City, CA 94587  
 Main Phone . 1 (510) 498-8888 
Main Fax . 1 (510) 498-8488

 

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                            Recommend for Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Active Cooler for 1U Server, Support CPU power up to 205 Watts heat dissipation.   Additional Information CPU Support Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake) CPU Socket FCLGA 3647 Narrow ILM Solution ·          1U Server and Up Dimensions ·          108 x 81 x 28 mm Weight ·          500g Material Copper1100 Heatsink with Vapor Chamber Basee Fan Dimension ·          Ø80 x 13 mm Speed ·          At Duty Cycle 20%: 1.08 W At Duty Cycle 50%: 4.70 W At Duty Cycle 100%: 23.45 W Bearing ·          Ball Type, Double Rated Voltage
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                              Copper skived fin passive heatsink for 1U server solution up to TDP 135 Watts.   Additional Information CPU Support Intel CPU Socket Intel Purley – EP / EX, Socket LGA 3647 Solution 1U Server and Up Dimensions 108 x 78 x 27.0 mm Weight 600 g Material Copper Skived fin Thermal Grease Shin-Etsu 7762 Pre-printed                                        *All product specifications and product imagesare subject to change without notice Downloads CPU Cooler Specification & RoHS Certificate     DYNATRON CORPORATION U.S.A. HEADQUARTERS 33200 Western Ave. Union City, CA 94587    Main Phone .   1 (510) 498-8888   Main Fax . 1 (510) 498-8488 info@dynatron.co www.dynatron.co www.dynatron.biz  
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