DYNATRON Air Cooler - A28

 

 

 

 

 

 

 

 

 

 

 

 

 

 

Copper 1100 Vapor Chamber and Stacked Fin passive heatsink for 1U server solution up to TDP 180 Watts heat dissipation.


Additional Information

CPU Support
  • AMD EPYC

CPU Socket
  • SP3/sWRX8

Solution
  • 1U Server and Up

Dimensions
  • 120 x 82 x 27 mm

Weight
  • 450 g

Material
  • Copper 1100 with Skiving Fin

Thermal Grease
  • Shin-Etsu 7762 Pre-printed

*All product specifications and product images are subject to change without notice.

 

Downloads

Specification

 
DYNATRON CORPORATION
U.S.A. HEADQUARTERS
33200 Western Ave. Union City, CA 94587  
 Main Phone . 1 (510) 498-8888 
Main Fax . 1 (510) 498-8488
 

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DYNATRON Air Cooler - B23

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                  Recommend for Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Active Cooler for Blade Server, Support CPU power up to 205 Watts heat dissipation.   Additional Information CPU Support ·          Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor ·          (formerly Cascade Lake, Skylake) CPU Socket FCLGA 3647 Narrow ILM Solution ·          1U Server Dimensions ·          108 x 81.5 x 25.5 mm Weight ·          460 g Material Copper1100 Heatsink with Vapor Chamber Base Fan Dimension ·          Ø80 x 13 mm Speed ·          At Duty Cycle 0~20%: 2000 ± 200 RPM At Duty Cycle 50%: 4900 ± 10% RPM At Duty Cycle 100%: 8600 ± 10% RPM Bearing ·          D
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DYNATRON Air Cooler - B22

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                            Recommend for Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Active Cooler for 1U Server, Support CPU power up to 205 Watts heat dissipation.   Additional Information CPU Support Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake) CPU Socket FCLGA 3647 Narrow ILM Solution ·          1U Server and Up Dimensions ·          108 x 81 x 28 mm Weight ·          500g Material Copper1100 Heatsink with Vapor Chamber Basee Fan Dimension ·          Ø80 x 13 mm Speed ·          At Duty Cycle 20%: 1.08 W At Duty Cycle 50%: 4.70 W At Duty Cycle 100%: 23.45 W Bearing ·          Ball Type, Double Rated Voltage
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DYNATRON Air Cooler - B1

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                              Copper skived fin passive heatsink for 1U server solution up to TDP 135 Watts.   Additional Information CPU Support Intel CPU Socket Intel Purley – EP / EX, Socket LGA 3647 Solution 1U Server and Up Dimensions 108 x 78 x 27.0 mm Weight 600 g Material Copper Skived fin Thermal Grease Shin-Etsu 7762 Pre-printed                                        *All product specifications and product imagesare subject to change without notice Downloads CPU Cooler Specification & RoHS Certificate     DYNATRON CORPORATION U.S.A. HEADQUARTERS 33200 Western Ave. Union City, CA 94587    Main Phone .   1 (510) 498-8888   Main Fax . 1 (510) 498-8488 info@dynatron.co www.dynatron.co www.dynatron.biz  
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