DYNATRON Air Cooler - B12



 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 Recommend for Intel® Xeon ® Platinum /Gold/Silver/Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Square ILM, Aluminum Stacked Fin Soldered on Copper Base with 4x Heat Pipes Embedded for 2U server & up solution, Support CPU Power Up to 205 Watts Heat Dissipation.


Additional Information

CPU Support

Intel

CPU Socket

FCLGA 3647 Square ILM

Solution

2U Server and Up

Dimensions

90 x 90 x 64 mm

Weight

590 g

Material

Aluminum Heatsink, Copper Base with Heatpipes Embedded

Thermal Grease

Shin-Etsu 7762 Pre-Applied

*All product specifications and product images are subject to change without notice

 

Downloads

CPU Cooler Specification & RoHS Certificate

 

 
DYNATRON CORPORATION
U.S.A. HEADQUARTERS
33200 Western Ave. Union City, CA 94587  
 Main Phone . 1 (510) 498-8888 
Main Fax . 1 (510) 498-8488
 

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DYNATRON Air Cooler - B23

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                  Recommend for Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Active Cooler for Blade Server, Support CPU power up to 205 Watts heat dissipation.   Additional Information CPU Support ·          Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor ·          (formerly Cascade Lake, Skylake) CPU Socket FCLGA 3647 Narrow ILM Solution ·          1U Server Dimensions ·          108 x 81.5 x 25.5 mm Weight ·          460 g Material Copper1100 Heatsink with Vapor Chamber Base Fan Dimension ·          Ø80 x 13 mm Speed ·          At Duty Cycle 0~20%: 2000 ± 200 RPM At Duty Cycle 50%: 4900 ± 10% RPM At Duty Cycle 100%: 8600 ± 10% RPM Bearing ·          D
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DYNATRON Air Cooler - B22

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                            Recommend for Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake), Socket FCLGA 3647 Narrow ILM, Active Cooler for 1U Server, Support CPU power up to 205 Watts heat dissipation.   Additional Information CPU Support Intel® Xeon ® Platinum / Gold / Silver/ Bronze Family Processor (formerly Cascade Lake, Skylake) CPU Socket FCLGA 3647 Narrow ILM Solution ·          1U Server and Up Dimensions ·          108 x 81 x 28 mm Weight ·          500g Material Copper1100 Heatsink with Vapor Chamber Basee Fan Dimension ·          Ø80 x 13 mm Speed ·          At Duty Cycle 20%: 1.08 W At Duty Cycle 50%: 4.70 W At Duty Cycle 100%: 23.45 W Bearing ·          Ball Type, Double Rated Voltage
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DYNATRON Air Cooler - B1

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                              Copper skived fin passive heatsink for 1U server solution up to TDP 135 Watts.   Additional Information CPU Support Intel CPU Socket Intel Purley – EP / EX, Socket LGA 3647 Solution 1U Server and Up Dimensions 108 x 78 x 27.0 mm Weight 600 g Material Copper Skived fin Thermal Grease Shin-Etsu 7762 Pre-printed                                        *All product specifications and product imagesare subject to change without notice Downloads CPU Cooler Specification & RoHS Certificate     DYNATRON CORPORATION U.S.A. HEADQUARTERS 33200 Western Ave. Union City, CA 94587    Main Phone .   1 (510) 498-8888   Main Fax . 1 (510) 498-8488 info@dynatron.co www.dynatron.co www.dynatron.biz  
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